Overview
Open 800G AI Spine Switch Platform
- 64×OSFP 800GbE, breakout to 2×400G / 4×200G / 8×100G
- 51.2Tbps, ultra-low latency, 75% power-efficiency gain
- 2+2 redundant 2000W PSU, 3+1 fans, dual airflow
- OCP ONIE open architecture · SONiC
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Overview
The DS5000 serves as our proven reference hardware platform for **OEM / ODM AI data-center switch projects**. Based on flagship Broadcom Tomahawk5 silicon, this 2U open bare-metal 800G spine switch can be adapted to your brand and technical requirements.
- 64×OSFP 800GbE, breakout to 2×400G / 4×200G / 8×100G
- 51.2Tbps, ultra-low latency, 75% power-efficiency gain
- 2+2 redundant 2000W PSU, 3+1 fans, dual airflow options
- OCP ONIE open architecture, compatible with SONiC
Key Features
- 2U rack-mount open bare-metal 800G data center spine switch, powered by flagship Broadcom Tomahawk5 ASIC, deeply optimized for AI large model training, HPC supercomputing and hyperscale cloud fabric.
- 64 × OSFP 800GbE high-density optical ports; each port supports flexible breakout into 2×400G / 4×200G / 8×100G sub-rate ports, meeting multi-layer CLOS leaf-spine deployment of AI spine core, storage aggregation and multi-cloud access.
- Industry-leading total switching bandwidth up to 51.2 Tbps with ultra-large shared packet buffer, ultra-low cut-through forwarding latency, excellent burst absorption for massive parallel AI training traffic; power efficiency improved by over 75% vs previous-generation 400G switches.
- Full redundant enterprise-grade reliable hardware: 2+2 redundant hot-swappable 2000W high-power AC power supplies, 3+1 redundant hot-swappable fan modules; dual airflow options (F2B / B2F) to match all types of server cabinet cooling layouts.
- High-performance multi-core Intel Xeon D modular x86 control plane, independent OpenBMC out-of-band management chip, fully compliant with IPMI 2.0 & Redfish standards; support remote hardware health monitoring, fault alarm and remote power on/off control.
- Standard OCP-based ONIE open bare-metal architecture, natively compatible with mainstream open NOS including SONiC, fully decoupled hardware & software to support highly customized AI computing fabric deployment.
- Complete full-stack L2/L3 routing protocols: IPv4/IPv6 dual stack, static route, OSPF, IS-IS, MP-BGP, ECMP/WCMP, VRF, VRRP, MC-LAG, IGMP/PIM multicast.
- Full DCB lossless Ethernet suite: DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification, optimized for RDMA low-latency lossless transmission of AI training & storage clusters.
- Hardware accelerated VXLAN overlay virtual tunnel, TRILL, NVGRE, supporting large-scale multi-tenant cloud virtual networking.
- Multi-level refined QoS scheduling, multi-port independent QoS queues, two-rate three-color traffic policing, DSCP mapping, airtime fairness and port bandwidth limitation to guarantee stable multi-service concurrent transmission.
- Comprehensive multi-layer security defense: hardware ACL filtering, anti-DDoS attack, port isolation, broadcast storm suppression, access control to prevent cross-tenant data leakage.
- Powerful automated O&M capabilities: ZTP zero-touch automatic deployment, high-precision real-time telemetry, packet timestamp, buffer transient traffic capture; support CLI, SSH, SNMP, REST API multi-mode management, easy docking with cloud native automation platforms.
- Optional IEEE1588v2 & SyncE high-precision clock synchronization module, compatible with ZR/ZR+ coherent long-distance optical modules to meet cross-data-center long-distance interconnection demands.
OEM / ODM Customization Options Based on DS5000 Platform
We support multiple-level customization for B2B partners based on this bare-metal switch platform.
- **White-Label Branding**: Custom front-panel silk-screen logo, custom model naming, customized packaging for your private-label product line.
- **Hardware Adjustment**: Selectable memory / storage configuration; adjust auxiliary port combinations according to project requirements.
- **Firmware & NOS adaptation**: Assist with SONiC configuration tuning, feature enable/disable, and specialized function tailoring.
- **Documentation Customization**: Custom datasheet, user manual and quick-start guide printed under your brand identity.
- **Project-oriented service**: Sample validation, small-batch trial production and mass-production delivery.
> This platform is widely adopted by system integrators, solution vendors and IT distributors for building their own branded 800G AI data-center switch products.
Specifications
Basic Hardware & Switch Chip
| Item |
Parameter |
| Model |
DS5000 |
| Switch ASIC |
Broadcom Tomahawk5 flagship switching chip |
| Form Factor |
19-inch standard 2U rack-mount chassis |
| Switching Bandwidth |
51.2 Tbps |
| Shared Packet Buffer |
Ultra-large high-capacity shared buffer |
| Cut-through Latency |
Ultra-low port-to-port forwarding latency |
| Forwarding Table Capacity |
Massive LPM routing table, multi-layer hardware ACL entry storage, support millions of cloud multi-tenant routes |
Interface Specifications
| Item |
Parameter |
| Data Ports |
64 × OSFP 800GbE high-density optical ports |
| Port Breakout Capability |
Each OSFP port supports flexible speed splitting: 2×400G / 4×200G / 8×100G sub-rate ports |
| Auxiliary Management Ports |
1 × RJ45 Gigabit shared CPU/BMC management Ethernet port; 1 × RJ45 RS232 serial Console debug port; 1 × Type-A USB 2.0 local storage port; Optional 1-2 × SFP+ 10G auxiliary optical ports |
Control Plane & BMC OOB Management
| Item |
Parameter |
| CPU Module |
COM-E modular Intel Xeon D x86 processor, 4-core standard configuration |
| Memory |
Standard 16GB ECC DDR4, expandable up to 32GB |
| Local Storage |
M.2 SSD (default 64GB) |
| BMC Management |
Independent BMC management chip, fully compliant with IPMI 2.0 standard; Support remote hardware health monitoring, fault alarm, remote power on/off control |
| Installation Architecture |
Standard ONIE open bare-metal installation system |
Power, Cooling & Power Consumption
| Item |
Parameter |
| Power Supply |
2+2 redundant hot-swappable 2000W AC power modules |
| Input Voltage |
AC 100-240V auto-ranging, 47-63Hz |
| Cooling Fans |
3+1 redundant hot-swappable fan modules |
| Airflow Options |
Dual airflow design, Front-to-Back (F2B) / Back-to-Front (B2F) optional |
| Peak Power Consumption |
2000W (with full OSFP 800G optical modules) |
Physical Dimension & Environment
| Item |
Parameter |
| Dimension |
H 87mm × W 438.5mm × D 750mm |
| Operating Temperature |
5℃ ~ +40℃ (both airflow modes) |
| Storage Temperature |
-40℃ ~ +70℃ |
| Operating Relative Humidity |
40% ~ 60% RH, non-condensing |
| Storage Relative Humidity |
5% ~ 95% RH, non-condensing |
| MTBF |
≥150,000 hours |
L2/L3 & Data Center Features
| Category |
Features |
| L2/L3 Routing Protocols |
IPv4/IPv6 dual stack, static route, RIP, OSPF, IS-IS, MP-BGP, ECMP/WCMP, VRF, VRRP; VLAN, STP/RSTP/MSTP, MC-LAG, IGMP Snooping, PIM-SM/PIM-DM/PIM-SSM multicast |
| DCB Lossless Ethernet |
DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification; Support RDMA low-latency lossless transmission for AI computing & storage clusters |
| Overlay Virtual Network |
VXLAN overlay tunnel encapsulation/decapsulation, TRILL, NVGRE, L2 GRE, hardware-based tunneling |
| QoS & Traffic Management |
10 independent QoS queues per port for unicast/multicast traffic; SP, WRR, WDRR multi-level scheduling, two-rate three-color traffic policing; Per-port DSCP mapping, airtime fairness scheduling, port-level bandwidth limitation |
| Security & Telemetry |
Multi-layer hardware ACL filtering, anti-DDoS attack defense, port isolation, storm control; Real-time high-precision telemetry, packet timestamp, buffer instantaneous traffic capture; Optional IEEE1588v2 & SyncE high-precision clock synchronization module |
Management Methods
| Category |
Items |
| Local Management |
CLI serial console, local WEB GUI |
| Remote Management |
SSH, SNMP v2c/v3, REST API, ZTP zero-touch automatic provisioning |
| Out-of-band Management |
BMC IPMI 2.0 remote power control, full hardware real-time health monitoring |
Application Scenarios
- AI large-model training cluster leaf-spine fabric networking
- Hyperscale cloud data center high-capacity spine-core deployment
- HPC / supercomputing interconnection
- High-density storage aggregation and multi-cloud cross-data-center interconnection
- Reference hardware platform for OEM / ODM private-label switch product development
For OEM-ODM customization requirement, sample request or project quotation, please contact our solution team.
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