Overview
100G Open Bare‑Metal Switch Platform
- 32×QSFP28 100GbE, breakout to 128×25G / 64×50G
- 1+1 redundant PSU, 3+1 fans, dual airflow options
- ONIE open architecture, SONiC / AsterNOS compatibility
- VXLAN, RDMA lossless, multi-layer ACL security
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Overview
The DS3000 serves as our proven reference hardware platform for **OEM / ODM data‑center switch projects**. Based on mature Broadcom Trident3‑X7 silicon, this 1U open bare‑metal switch can be adapted to your brand and technical requirements.
- 32×QSFP28 100GbE ports, breakout to 128×25G / 64×50G
- 1+1 redundant PSU, 3+1 hot‑swappable fans, dual airflow options
- ONIE open architecture, compatible with SONiC / AsterNOS network operating systems
- Supports VXLAN, RDMA lossless networking and multi‑layer ACL security
Key Features
- High switching capacity up to 3.2Tbps, low‑latency forwarding optimized for data center leaf‑spine fabric
- Hot‑swappable fan modules and redundant power supplies for high availability deployment
- Flexible port breakout capability to match diverse rack and fabric topologies
- Open ONIE bootloader, ready for integration with mainstream open network operating systems
- Comprehensive security features: ACL, port security, traffic policing and telemetry monitoring
- Dual airflow design (port‑to‑PSU / PSU‑to‑port) to adapt different rack thermal requirements
OEM / ODM Customization Options Based on DS3000 Platform
We support multiple‑level customization for B2B partners based on this bare‑metal switch platform.
- **White‑Label Branding**: Custom front‑panel silk‑screen logo, custom model naming, customized packaging for your private‑label product line.
- **Hardware Adjustment**: Selectable memory / storage configuration; adjust auxiliary port combinations according to project requirements.
- **Firmware & NOS adaptation**: Assist with SONiC configuration tuning, feature enable/disable, and specialized function tailoring.
- **Documentation Customization**: Custom datasheet, user manual and quick‑start guide printed under your brand identity.
- **Project‑oriented service**: Sample validation, small‑batch trial production and mass‑production delivery.
> This platform is widely adopted by system integrators, solution vendors and IT distributors for building their own branded 100G data‑center switch products.
Specifications
Basic Hardware & Switch Chip
| Item |
Parameter |
| Model |
DS3000 |
| Switch ASIC |
Broadcom Trident3‑X7 (BCM56870) |
| Form Factor |
19‑inch standard 1U rack‑mount chassis |
| Forwarding Architecture |
PHYless simplified hardware |
| Switching Bandwidth |
3.2 Tbps |
| Packet Buffer |
32MB shared packet buffer |
| Cut‑through Latency |
<500ns port‑to‑port latency |
| Max Concurrent Forwarding Entries |
324K LPM routing table, 128K ACL entries, 48K MPLS labels |
Interface Specifications
| Item |
Parameter |
| Data Port |
32 × QSFP28 100GbE optical ports |
| Port Breakout Support |
Each QSFP28 can split into 4×25G or 2×50G; maximum 128×25G sub‑rate ports |
| Auxiliary Ports |
1‑2 × SFP+ 10G auxiliary optical ports; 1 × RJ45 shared management Ethernet port; 1 × RJ45 serial Console port |
Control Plane & BMC OOB Management
| Item |
Parameter |
| CPU Module |
COM‑E modular Intel Atom C3558R x86 processor |
| Memory |
4GB‑32GB configurable ECC DDR4 |
| Local Storage |
M.2 SSD (default 64GB) |
| BMC Management |
Independent BMC chip, support IPMI 2.0 remote out‑of‑band management |
| Installation Architecture |
Standard ONIE open bare‑metal installation system |
| Compatible NOS |
SONiC, AsterNOS and other mainstream open network operating systems |
Power, Cooling & Power Consumption
| Item |
Parameter |
| Power Supply |
1+1 redundant hot‑swappable AC power modules |
| Input Voltage |
AC 100‑240V auto‑ranging, 47‑63Hz |
| Cooling Fans |
3+1 redundant hot‑swappable fan |
| Airflow Options |
Front‑to‑Back (F2B) / Back‑to‑Front (B2F) dual airflow design |
| Peak Power Consumption |
≤500W under full optical module load |
Physical Dimension & Environment
| Item |
Parameter |
| Dimension |
H 44mm × W 438mm × D 520mm |
| Operating Temperature |
0°C ~ +45°C (altitude ≤900m) |
| Storage Temperature |
-40°C ~ +70°C |
| Humidity |
5% ~ 90% RH, non‑condensing |
| MTBF |
≥150,000 hours |
L2/L3 & Data Center Features
| Category |
Features |
| L2/L3 Protocols |
IPv4/IPv6 dual stack, static route, RIP, OSPF, MP‑VLAN, STP/RSTP/MSTP, IGMP Snooping, MC‑LAG |
| Data Center DCB & Lossless Ethernet |
DCBX, PFC, ETS, QCN congestion notification; VXLAN overlay virtual network (encapsulation/decapsulation TEP); TRILL, NVGRE, L2 GRE overlay tunneling |
| QoS & Traffic Management |
Multi‑level queue scheduling (SP, WRR, WDRR), per‑port DSCP mapping; Two‑rate three‑color policing, airtime fairness scheduling; RDMA low‑latency lossless transmission support |
| Security & Telemetry |
Multi‑layer ACL filtering, anti‑DDoS attack defense; Real‑time telemetry, packet timestamp, buffer transient capture statistics; IEEE1588 & SyncE precision clock synchronization |
Management Methods
| Category |
Items |
| Local Management |
CLI serial console, local WEB GUI |
| Remote Management |
SSH, SNMP v2c/v3, REST API, ZTP zero‑touch provisioning |
| Out‑of‑band Management |
BMC IPMI 2.0 remote power control, hardware health monitoring |
Application Scenarios
- AI computing cluster leaf‑spine fabric
- Enterprise and carrier data center networking
- Cloud colocation and multi‑tenant virtualized network
- High‑performance storage networking with RDMA
- Reference hardware platform for OEM / ODM private‑label switch product development
For OEM‑ODM customization requirement, sample request or project quotation, please contact our solution team.
Request OEM / ODM Quote
